INTEL i7-7700 4.2 GHZ SEPTIMA GENERACION Kaby Lake

INTEL i7-7700 4.2 GHZ SEPTIMA GENERACION Kaby Lake

Artículo N° : 50756

$31.101,00

Processor Number i7-7700
Status Launched
Launch Date Q1'17
Lithography 14 nm

-Performance
# of Cores 4
# of Threads 8
Processor Base Frequency 3.60 GHz
Max Turbo Frequency 4.20 GHz
Cache 8 MB SmartCache
Bus Speed 8 GT/s DMI3
# of QPI Links 0
TDP 65 W
-Supplemental Information
Embedded Options Available Yes
Conflict Free Yes
Datasheet Link
-Memory Specifications
Max Memory Size (dependent on memory type) 64 GB
Memory Types DDR4-2133/2400, DDR3L-1333/1600 @ 1.35V
Max # of Memory Channels 2
ECC Memory Supported ‡ No
-Graphics Specifications
Processor Graphics ‡ Intel® HD Graphics 630
Graphics Base Frequency 350.00 MHz
Graphics Max Dynamic Frequency 1.15 GHz
Graphics Video Max Memory 64 GB
4K Support Yes, at 60Hz
Max Resolution (HDMI 1.4)‡ 4096x2304@24Hz
Max Resolution (DP)‡ 4096x2304@60Hz
Max Resolution (eDP - Integrated Flat Panel)‡ 4096x2304@60Hz
DirectX* Support 12
OpenGL* Support 4.4
Intel® Quick Sync Video Yes
Intel® InTru™ 3D Technology Yes
Intel® Clear Video HD Technology Yes
Intel® Clear Video Technology Yes
# of Displays Supported ‡ 3
Device ID 0x5912
-Expansion Options
Scalability 1S Only
PCI Express Revision 3.0
PCI Express Configurations ‡ Up to 1x16, 2x8, 1x8+2x4
Max # of PCI Express Lanes 16
-Package Specifications
Sockets Supported FCLGA1151
Max CPU Configuration 1
Thermal Solution Specification PCG 2015C (65W)
TJUNCTION 100°C
Package Size 37.5mm x 37.5mm
Low Halogen Options Available See MDDS
-Advanced Technologies
Intel® Turbo Boost Technology ‡ 2.0
Intel® vPro Technology ‡ Yes
Intel® Hyper-Threading Technology ‡ Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
Intel® TSX-NI Yes
Intel® 64 ‡ Yes
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX 2.0
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Thermal Monitoring Technologies Yes
Intel® Identity Protection Technology ‡ Yes
Intel® Stable Image Platform Program (SIPP) Yes
-Intel® Data Protection Technology
Intel® AES New Instructions Yes
Secure Key Yes
Intel® Software Guard Extensions (Intel® SGX) Yes
Intel® Memory Protection Extensions (Intel® MPX) Yes
-Intel® Platform Protection Technology
OS Guard Yes
Trusted Execution Technology ‡ Yes
Execute Disable Bit ‡ Yes
Intel® Device Protection Technology with Boot Guard Yes
Related Products
7th Generation Intel® Core™ i7 Processors
Intel® Core™ i7-7700 Desktop Processor Series
Products formerly Kaby Lake
Learn how Intel is pursuing conflict-free technology.
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PCN/MDDS Information
SR338
953004: PCN | MDDS
953654: PCN | MDDS
953712: PCN | MDDS
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.

Refer to Datasheet for formal definitions of product properties and features.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

For benchmarking data see http://www.intel.com/performance.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.

Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.

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